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Chip Scale Packaging Design, Materials, Processes and Realiablity, and Applications
by Lau, John H., Lee, S. W. Ricky
ISBN: 9780070383043
List Price: $89.50
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Microvias Low Cost, High Density Interconnects
by Lau, John H., Lee, Ricky S. W.
ISBN: 9780071363273
List Price: $99.95
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How I Got Published and What I Learned Along the Way
by A. Lee Martinez, Carolyn Ra...
ISBN: 9781696143950
List Price: $12.95
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